Particle Impact Noise Detection (PIND) combines vibration, shock, and acoustics for determining reliability of electronic components.
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Abstract: Particle Impact Noise Detection (P.I.N.D.) is a reliability screening technique that
employs vibration, shock, and acoustics. As a requirement for MIL-STD883E, MIL-STD750,
and MIL-STD39016, this test has helped the manufacturers of hermetically sealed
electronic components greatly increase the reliability of their product by eliminating
contaminants within the cavity over the past thirty years. Recent advancements in
packaging methods have created significantly larger packages with increased weight and
require improvements to the test equipment including advancements to the closed loop
control of vibration, increased dynamic range of closed loop control of shock, and the
addition of multiple crystal acoustic detection sensors. This paper will describe these
advancements and their effects in helping the test systems to better handle the challenge
presented by multi-chip modules (MCM), and Systems on Chip (SOC), and today’s’ larger